Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US16837051Application Date: 2020-04-01
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Publication No.: US11380803B2Publication Date: 2022-07-05
- Inventor: Hou-Yu Chen , Chao-Ching Cheng , Tzu-Chiang Chen , Yu-Lin Yang , I-Sheng Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/786 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes an isolation layer formed over a substrate, and a plurality of nanostructures formed over the isolation layer. The semiconductor device structure includes a gate structure wrapped around the nanostructures, and an S/D structure wrapped around the nanostructures. The semiconductor device structure includes a first oxide layer between the substrate and the S/D structure. The first oxide layer and the isolation layer are made of different materials. The first oxide layer is in direct contact with the isolation layer.
Public/Granted literature
- US20200227570A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2020-07-16
Information query
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