Invention Grant
- Patent Title: Silicon carbide device with Schottky contact
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Application No.: US16733329Application Date: 2020-01-03
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Publication No.: US11380756B2Publication Date: 2022-07-05
- Inventor: Caspar Leendertz , Rudolf Elpelt , Romain Esteve , Thomas Ganner , Jens Peter Konrath , Larissa Wehrhahn-Kilian
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Cooper Legal Group LLC
- Priority: DE102019100110.2 20190104,DE102019130376.1 20191111
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/16 ; H01L29/45 ; H01L29/47

Abstract:
A silicon carbide device includes a silicon carbide body including a source region of a first conductivity type, a cathode region of the first conductivity type and separation regions of a second conductivity type. A stripe-shaped gate structure extends along a first direction and adjoins the source region and the separation regions. The silicon carbide device includes a first load electrode. Along the first direction, the cathode region is between two separation regions of the separation regions and at least one separation region of the separation regions is between the cathode region and the source region. The source region and the first load electrode form an ohmic contact. The first load electrode and the cathode region form a Schottky contact.
Public/Granted literature
- US20200219972A1 SILICON CARBIDE DEVICE WITH SCHOTTKY CONTACT Public/Granted day:2020-07-09
Information query
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