Invention Grant
- Patent Title: Compound capacitor structures
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Application No.: US16650826Application Date: 2017-12-18
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Publication No.: US11380755B2Publication Date: 2022-07-05
- Inventor: Domagoj Siprak , Jonas Fritzin , Sundaravadanan Anantha Krishnan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2017/067094 WO 20171218
- International Announcement: WO2019/125385 WO 20190627
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/66 ; H01P3/02 ; H01L23/522

Abstract:
Capacitors are disclosed. A capacitor includes a plate-to-plate capacitor and a finger-to-finger capacitor. The plate-to-plate capacitor includes at least a first plate and a second plate. The second plate is in proximity to the first plate. The finger to finger capacitor is in proximity to the first plate. The finger to finger capacitor includes a first plurality of finger elements and a second plurality of finger elements. The second plurality of finger elements is interleaved with the first plurality of finger elements. The first plurality of finger elements is electrically connected to the first plate and the second plurality of finger elements is electrically connected to the second plate. The second plurality of finger elements and the first plate form additional plate-to-plate capacitors.
Public/Granted literature
- US20200279908A1 COMPOUND CAPACITOR STRUCTURES Public/Granted day:2020-09-03
Information query
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