Invention Grant
- Patent Title: Method of manufacturing light-emitting device and method of manufacturing light-emitting module
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Application No.: US17024704Application Date: 2020-09-18
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Publication No.: US11380659B2Publication Date: 2022-07-05
- Inventor: Takashi Ishii , Dai Wakamatsu , Hiroaki Kageyama
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JPJP2019-172787 20190924
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/075 ; H01L33/62 ; H01L33/60 ; H01L25/16 ; H01L33/56

Abstract:
A method of manufacturing a light-emitting device that includes providing a plurality of element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order. The method further includes disposing the plurality of element structures such that the light-transmissive members face a sheet member, and forming a covering member on the sheet member to cover at least a portion of each of lateral surfaces of the submount substrate of each of the element structures.
Public/Granted literature
- US20210091051A1 METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE Public/Granted day:2021-03-25
Information query
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