Invention Grant
- Patent Title: Method and related structure to authenticate integrated circuit with authentication film
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Application No.: US16953441Application Date: 2020-11-20
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Publication No.: US11380622B2Publication Date: 2022-07-05
- Inventor: Vibhor Jain , Sunil K. Singh , Johnatan A. Kantarovsky , Siva P. Adusumilli , Sebastian T. Ventrone , John J. Ellis-Monaghan , Yves T. Ngu
- Applicant: GLOBALFOUNDRIES U.S. INC.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. INC.
- Current Assignee: GLOBALFOUNDRIES U.S. INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/00
Abstract:
The disclosure provides a method to authenticate an integrated circuit (IC) structure. The method may include forming a first authentication film (AF) material within the IC structure. A composition of the first AF material is different from an adjacent material within the IC structure. The method includes converting the first AF material into a void within the IC structure. Additionally, the method includes creating an authentication map of the IC structure to include a location of the void in the IC structure for authentication of the IC structure.
Public/Granted literature
- US20220165676A1 METHOD AND RELATED STRUCTURE TO AUTHENTICATE INTEGRATED CIRCUIT WITH AUTHENTICATION FILM Public/Granted day:2022-05-26
Information query
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