Invention Grant
- Patent Title: Method for assembling keyswitch device
-
Application No.: US17035764Application Date: 2020-09-29
-
Publication No.: US11380494B2Publication Date: 2022-07-05
- Inventor: Wen-Bin Chen
- Applicant: Chicony Electronics Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Chicony Electronics Co., Ltd.
- Current Assignee: Chicony Electronics Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Priority: TW106145127 20171221
- Main IPC: H01H3/12
- IPC: H01H3/12 ; H01H13/88 ; G06F1/16 ; B29C59/16

Abstract:
A method for assembling a keyswitch device includes: connecting a first covering portion to a surface of a first housing; connecting a second covering portion to a connection base comprising an engaging portion; rotatably engaging the engaging portion with an engaging structure; connecting the engaging structure to the first housing; and fixing a second housing to the first housing such that the first housing and the second housing constitute a recess communicating with the surface, wherein the engaging structure partially protrudes into the recess.
Public/Granted literature
- US20210012979A1 METHOD FOR ASSEMBLING KEYSWITCH DEVICE Public/Granted day:2021-01-14
Information query