Invention Grant
- Patent Title: Touch module
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Application No.: US17086543Application Date: 2020-11-02
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Publication No.: US11379085B2Publication Date: 2022-07-05
- Inventor: Qi Bin Liu , Kuo Lung Fang , Ya Mei Chen , Ya Ting Hsu
- Applicant: TPK Advanced Solutions Inc.
- Applicant Address: CN Fujian
- Assignee: TPK Advanced Solutions Inc.
- Current Assignee: TPK Advanced Solutions Inc.
- Current Assignee Address: CN Fujian
- Agency: Cooper Legal Group, LLC
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044

Abstract:
The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first bridging layer, a first touch sensing layer, a second bridging layer, and a second touch sensing layer. The first bridging layer extends on the substrate along a first direction. The first touch sensing layer is disposed on the substrate and includes a plurality of first touch sensing electrodes, wherein the first bridging layer connects adjacent first touch sensing electrodes of the first touch sensing electrodes. The second bridging layer is disposed on the first bridging layer, located between the adjacent first touch sensing electrodes, and connected in parallel with the first bridging layer. The second touch sensing layer is disposed on the substrate, crosses the second bridging layer along a second direction, and is disposed between the adjacent first touch sensing electrodes.
Public/Granted literature
- US20220137748A1 TOUCH MODULE Public/Granted day:2022-05-05
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