Invention Grant
- Patent Title: Infrared sensor structure
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Application No.: US16961955Application Date: 2018-08-29
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Publication No.: US11378459B2Publication Date: 2022-07-05
- Inventor: Xiaoxu Kang
- Applicant: SHANGHAI IC R&D CENTER CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI IC R&D CENTER CO., LTD.
- Current Assignee: SHANGHAI IC R&D CENTER CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Tianchen LLC.
- Agent Yuan R. Li; Yi Fan Yin
- Priority: CN201810230944.6 20180320
- International Application: PCT/CN2018/102892 WO 20180829
- International Announcement: WO2019/179046 WO 20190926
- Main IPC: G01J5/02
- IPC: G01J5/02 ; G01J5/08 ; G01J5/38 ; H01H1/00 ; H01H37/00 ; H01L31/024 ; H01L31/101 ; B81B3/00 ; H01H37/72

Abstract:
The present disclosure discloses an infrared sensor structure, comprises a cantilever switch array, the cantilever switch array comprises cantilever switches, and each cantilever switch comprises a cantilever beam and a switch corresponding to the cantilever beam, vertical heights from the cantilever beams to the switches in different cantilever switches are different from each other, when the cantilever beams are deformed towards the switches and connect to the switches, the switches turn on; wherein, deformations of different cantilever beams produced by absorbing infrared signal are different from each other, the intensity of the infrared signal can be quantified by number of the switches on, so as to realize detection of the infrared signal. The manufacturing of the infrared sensor structure in the present disclosure can be compatible with the existing semiconductor CMOS process.
Public/Granted literature
- US20210055163A1 INFRARED SENSOR STRUCTURE Public/Granted day:2021-02-25
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