Invention Grant
- Patent Title: Two-phase metallic alloys to facilitate thermal energy storage of a system on chip
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Application No.: US16147548Application Date: 2018-09-28
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Publication No.: US11378346B2Publication Date: 2022-07-05
- Inventor: Je-Young Chang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/36
- IPC: H01L23/36 ; F28D20/02 ; H01L23/373 ; H01L23/367 ; C09K5/06 ; H01L49/02
Abstract:
Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.
Information query
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