Invention Grant
- Patent Title: N-type silicon single crystal production method, n-type silicon single crystal ingot, silicon wafer, and epitaxial silicon wafer
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Application No.: US16607205Application Date: 2018-03-29
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Publication No.: US11377755B2Publication Date: 2022-07-05
- Inventor: Koichi Maegawa , Yasuhito Narushima , Yasufumi Kawakami , Fukuo Ogawa , Yuuji Tsutsumi
- Applicant: SUMCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMCO CORPORATION
- Current Assignee: SUMCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-086531 20170425
- International Application: PCT/JP2018/013362 WO 20180329
- International Announcement: WO2018/198663 WO 20181101
- Main IPC: C30B15/04
- IPC: C30B15/04 ; C30B29/06 ; C30B15/14 ; C30B15/20

Abstract:
An n-type silicon single crystal production method of pulling up a silicon single crystal from a silicon melt containing red phosphorus as a principal dopant and growing the silicon single crystal by the Czochralski process, the method including: controlling electrical resistivity at a start position of a straight body portion of the silicon single crystal to 0.80 mΩcm or more and 1.05 mΩcm or less; and sequentially lowering the electrical resistivity of the silicon single crystal as the silicon single crystal is up and grown, thereby adjusting electrical resistivity of a part of the silicon single crystal to 0.5 mΩm or more and less than 0.6 mΩcm.
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