Invention Grant
- Patent Title: Hot melt composition
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Application No.: US16881369Application Date: 2020-05-22
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Publication No.: US11377549B2Publication Date: 2022-07-05
- Inventor: Shingo Tsuno , Masaaki Dobashi , Takahide Morishita , Koji Shirai
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann; Steven C. Bauman
- Priority: JPJP2017-228106 20171128
- Main IPC: C08L53/02
- IPC: C08L53/02 ; C08L91/06 ; C09J153/02 ; H05K5/06

Abstract:
An objective of the present invention is to provide a hot melt composition which has a high form maintaining property at a high temperature, is well-balanced between adhesion and removability to a substrate, hardly sags, has less volatile matter content and is excellent in hygiene. The present invention relates to a hot melt composition comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B1) a hydrocarbon-based oil having an aniline point of 135° C. or more, and (C) a wax modified with a carboxylic acid and/or a carboxylic acid anhydride.
Public/Granted literature
- US20200283616A1 HOT MELT COMPOSITION Public/Granted day:2020-09-10
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