Invention Grant
- Patent Title: Labeling system and labeling method
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Application No.: US17084002Application Date: 2020-10-29
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Publication No.: US11377249B2Publication Date: 2022-07-05
- Inventor: Roberto Francisco-Yi Lu , Yingcong Deng , Dandan Zhang , Lvhai Hu , Zongjie Tao
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH
- Applicant Address: CN Shanghai; CH Schaffhausen
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Services GmbH
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Services GmbH
- Current Assignee Address: CN Shanghai; CH Schaffhausen
- Agency: Barley Snyder
- Main IPC: B65C9/40
- IPC: B65C9/40 ; B65C9/02 ; B65C1/02 ; B65C9/26
Abstract:
A labeling system includes a pasting unit having a first mechanical arm adapted to pick up a label to be pasted, at least one visual device configured to guide the first mechanical arm to paste the label on an object, and at least one scanning device adapted to scan the label pasted on the object.
Public/Granted literature
- US20210130028A1 Labeling System And Labeling Method Public/Granted day:2021-05-06
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