Invention Grant
- Patent Title: Substrate processing apparatus and purging method
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Application No.: US16549418Application Date: 2019-08-23
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Publication No.: US11367642B2Publication Date: 2022-06-21
- Inventor: Moriyoshi Kinoshita , Yuji Sasaki , Junichi Sato , Takashi Asakawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2018-167219 20180906
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/67 ; F27D3/00 ; H01L21/677 ; F27D7/06
Abstract:
A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.
Public/Granted literature
- US20200083078A1 SUBSTRATE PROCESSING APPARATUS AND PURGING METHOD Public/Granted day:2020-03-12
Information query
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