Invention Grant
- Patent Title: Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool
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Application No.: US16750138Application Date: 2020-01-23
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Publication No.: US11367629B2Publication Date: 2022-06-21
- Inventor: Hideaki Tanaka
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2019-014133 20190130
- Main IPC: H01L21/67
- IPC: H01L21/67 ; A46B17/06 ; B08B5/04 ; H01L21/02 ; B08B1/04 ; A46B13/00
Abstract:
A cleaning apparatus for cleaning a cleaning tool that scrub-cleans a substrate includes a cleaning body. The cleaning body includes a contact portion configured to come into contact with the cleaning tool, and the contact portion includes a suction area configured to remove foreign matter from the cleaning tool.
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