Invention Grant
- Patent Title: Reference metal layer for setting the impedance of metal contacts of a connector
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Application No.: US16953673Application Date: 2020-11-20
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Publication No.: US11297713B2Publication Date: 2022-04-05
- Inventor: Manhtien V. Phan , Mau-Lin Chou , Chih-Hao Lee
- Applicant: SUPER MICRO COMPUTER, INC.
- Applicant Address: US CA San Jose
- Assignee: SUPER MICRO COMPUTER, INC.
- Current Assignee: SUPER MICRO COMPUTER, INC.
- Current Assignee Address: US CA San Jose
- Agent Patrick D. Benedicto
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/16 ; H01R13/66 ; H01R13/629 ; H01R13/646 ; H01R13/6469 ; H01R13/6471 ; H01R13/6473 ; H01R43/20
Abstract:
A circuit board has an electrical circuit and a connector that is attached to the circuit board. The connector has metal contacts. A housing of the connector has an embedded reference metal layer that is disposed under a single-ended metal contact or differential metal contacts. The reference metal layer sets the impedance of the single-ended metal contact or the differential metal contacts.
Public/Granted literature
- US20210235577A1 REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS OF A CONNECTOR Public/Granted day:2021-07-29
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