Invention Grant
- Patent Title: Electrostatic discharge protection circuit
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Application No.: US16935769Application Date: 2020-07-22
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Publication No.: US11296502B2Publication Date: 2022-04-05
- Inventor: Ming-Fang Lai , Yi-Hsun Wu , Ching-Yun Chang
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H02H9/04
- IPC: H02H9/04

Abstract:
An electrostatic discharge protection circuit includes an electrostatic discharge clamp between a first rail and a second rail, a trigger device configured to activate the electrostatic discharge clamp in response to an electrostatic discharge event, and a charge dissipation element between the first rail and the second rail to dissipate a residual charge at an input of the trigger device.
Public/Granted literature
- US20220029413A1 ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT Public/Granted day:2022-01-27
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