Invention Grant
- Patent Title: Side-bonding structure of display panel and manufacturing method thereof
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Application No.: US16755572Application Date: 2020-02-28
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Publication No.: US11296130B2Publication Date: 2022-04-05
- Inventor: Aihua Tang
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- International Application: PCT/CN2020/077199 WO 20200228
- International Announcement: WO2021/138985 WO 20210705
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/32 ; G02F1/1333 ; G02F1/1345

Abstract:
The present application provides a display panel and a manufacturing method thereof. The display panel includes a first substrate, a plurality of bonding pads, an insulating adhesive, a sealant, a blocking layer, a second substrate, and a chip on film (COF). The display panel of the present application effectively reduces an area of a non-display region of a display panel in the prior art by side-bonding the COF and realizes an ultra-narrow bezel display with a width of the non-display region being less than 1 mm. Meanwhile, through a configuration of the blocking layer, the conductive adhesive can be prevented from overflowing and causing short circuits between each of the plurality of bonding pads.
Public/Granted literature
- US20210210530A1 SIDE-BONDING STRUCTURE OF DISPLAY PANEL AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-07-08
Information query
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