Invention Grant
- Patent Title: Structures for providing electrical isolation in semiconductor devices
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Application No.: US16667985Application Date: 2019-10-30
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Publication No.: US11296055B2Publication Date: 2022-04-05
- Inventor: Chan-Hong Chern , Mark Chen
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L25/00 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L29/20 ; H01L29/205 ; H01L29/778 ; H01L29/66 ; H01L21/02
Abstract:
Semiconductor package structures are provided. An interposer is bonded to a printed circuit board (PCB) or package substrate through first solder bumps disposed on a first side of the interposer. The first solder bumps have a first pitch. A plurality of semiconductor chips are formed, and each of the semiconductor chips is bonded to a second side of the interposer through second solder bumps. The second solder bumps have a second pitch that is less than the first pitch. Each of the semiconductor chips includes a substrate with one or more transistors or integrated circuits formed thereon.
Public/Granted literature
- US20200066685A1 Structures for Providing Electrical Isolation in Semiconductor Devices Public/Granted day:2020-02-27
Information query
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