- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16592543Application Date: 2019-10-03
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Publication No.: US11296001B2Publication Date: 2022-04-05
- Inventor: Guo-Cheng Liao , Yi Chuan Ding
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L25/065 ; H01L23/498 ; H01L23/544
Abstract:
A package substrate includes a first dielectric layer, a first patterned conductive layer and a first set of alignment marks. The first patterned conductive layer is disposed on the first dielectric layer. The first set of alignment marks is disposed on the first dielectric layer and adjacent to a first edge of the first dielectric layer. The first set of alignment marks includes a plurality of alignment marks. Distances between the alignment marks of the first set of alignment marks and the first edge are different from each other.
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