Invention Grant
- Patent Title: Hybridization for characterization and metrology
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Application No.: US16200764Application Date: 2018-11-27
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Publication No.: US11295969B2Publication Date: 2022-04-05
- Inventor: Gangadhara Raja Muthinti , Matthew Sendelbach , Roy Koret , Aron Cepler , Wei Ti Lee
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01B15/02 ; G01B11/06

Abstract:
A computer-implemented method for measuring a parameter of a semiconductor. A non-limiting example of the computer-implemented method includes receiving, using a processor, a raw signal from a first tool representing a measured parameter of a semiconductor device. The method also receives, using the processor, data on the measured parameter from a second tool, and calculates, using the processor, the measured parameter based on the data received from the second tool and on a constraint based on the raw signal from the first tool.
Public/Granted literature
- US20200168489A1 HYBRIDIZATION FOR CHARACTERIZATION AND METROLOGY Public/Granted day:2020-05-28
Information query
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