Invention Grant
- Patent Title: Head positioning assembly for tape embedded drive
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Application No.: US16905781Application Date: 2020-06-18
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Publication No.: US11295771B2Publication Date: 2022-04-05
- Inventor: Akira Sakagami , Kouki Uefune , Toshio Takahashi
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Agent Steven H. Versteeg
- Main IPC: G11B5/55
- IPC: G11B5/55 ; G11B5/48 ; G11B5/008 ; G11B15/28 ; G11B15/32 ; G11B23/087

Abstract:
The present disclosure generally relates to a head positioning assembly in a tape embedded drive. The tape embedded drive has two reels as well as four guide rollers. The reels and guide rollers are arranged within the tape embedded drive so as to position the head positioning assembly as close to the center of the tape embedded drive as possible. In so doing, the reels, guide rollers, and head assembly are more stable which reduces or even eliminates shock and vibration to the tape embedded drive.
Public/Granted literature
- US20210398558A1 Head Positioning Assembly For Tape Embedded Drive Public/Granted day:2021-12-23
Information query
IPC分类: