Invention Grant
- Patent Title: System and method for integrated thermal and cable routing for server rear modules
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Application No.: US16939638Application Date: 2020-07-27
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Publication No.: US11294433B2Publication Date: 2022-04-05
- Inventor: Yi Chang Chen , Kuang Hsi Lin
- Applicant: DELL PRODUCTS, LP
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS, LP
- Current Assignee: DELL PRODUCTS, LP
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/18 ; H01R12/73 ; G06F1/20

Abstract:
An information processing system includes a processor, a memory device, and riser card. The riser card includes a riser card cage, a circuit card, and a baffle. The circuit card is installed into the riser card cage and includes a card edge and a connector affixed to the circuit card. The card edge is configured to be installed into another connector on an information handling system in a first orientation. The connector is configured to receive a card edge of an add-in card in a second orientation perpendicular to the first orientation. The baffle is integrated with the riser card cage. The baffle is configured to divert a first air flow from the processor away from the riser card cage, and to channel a second air flow from the memory device into the riser card cage.
Public/Granted literature
- US20220026965A1 SYSTEM AND METHOD FOR INTEGRATED THERMAL AND CABLE ROUTING FOR SERVER REAR MODULES Public/Granted day:2022-01-27
Information query