Invention Grant
- Patent Title: Test socket
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Application No.: US16366093Application Date: 2019-03-27
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Publication No.: US11293944B2Publication Date: 2022-04-05
- Inventor: Yuji Nakamura , Masashi Iwata
- Applicant: Yamaichi Electronics Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JPJP2018-068179 20180330
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R1/067 ; H01R13/24 ; H01R24/50 ; H05K7/10 ; H01R13/6473 ; H01R12/73 ; H01R12/71

Abstract:
The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.
Public/Granted literature
- US20190302144A1 TEST SOCKET Public/Granted day:2019-10-03
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