Invention Grant
- Patent Title: Sensor assembly and physical quantity measuring device
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Application No.: US16691769Application Date: 2019-11-22
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Publication No.: US11293824B2Publication Date: 2022-04-05
- Inventor: Nobuaki Kawase , Toshinori Suzuki
- Applicant: NAGANO KEIKI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2018-222336 20181128
- Main IPC: G01K11/30
- IPC: G01K11/30 ; G01L19/00 ; G01K7/18 ; G01K15/00 ; G01K1/14 ; G01K1/08

Abstract:
A sensor assembly includes: a sensor module including a cylindrical portion into which a measurement target fluid is introduced and a diaphragm including a first surface in contact with the measurement target fluid and a second surface provided with a detector; a joint provided with a pressure introduction port for introducing the measurement target fluid to the sensor module; a cylindrical base member surrounding the sensor module; an electronic circuit attached to the base member to receive a detection signal outputted by the detector; and a temperature sensor electrically connected with the electronic circuit. The temperature sensor includes a temperature detector for detecting temperature, and a lead wire electrically connecting the temperature detector and the electronic circuit. The base member is provided with a receiver for receiving the temperature detector and the lead wire.
Public/Granted literature
- US20200166425A1 SENSOR ASSEMBLY AND PHYSICAL QUANTITY MEASURING DEVICE Public/Granted day:2020-05-28
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