A heat-pump using apparatus includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit is capable of executing a heating operation and a cooling operation. A first expansion device is provided downstream of a reservoir, and a second expansion device is provided upstream of the reservoir, in the flow of refrigerant in the heating operation. A main circuit of the heat medium circuit includes a branching part and a joining part. An overpressure protection device is connected to a connection part which is located between a load-side heat exchanger and one of the branching part and the joining part or at the load-side heat exchanger. A refrigerant leakage detecting device is connected to the other of the branching part and the joining part, or between the other of the branching part and the joining part and the connection part, or to the connection part.