Invention Grant
- Patent Title: Adhesive resin composition and laminate
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Application No.: US17046626Application Date: 2019-04-05
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Publication No.: US11292945B2Publication Date: 2022-04-05
- Inventor: Akihiko Iwashita , Yoshiyuki Ogawa
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2018-083800 20180425
- International Application: PCT/JP2019/015117 WO 20190405
- International Announcement: WO2019/208169 WO 20191031
- Main IPC: B65D65/40
- IPC: B65D65/40 ; C09J151/06 ; C09J123/26 ; C09J151/00 ; B32B7/12 ; B32B27/08 ; B32B27/32 ; B32B27/34 ; B32B1/00 ; B32B27/30

Abstract:
An adhesive resin composition of the invention includes an ethylene polymer (A) including an ethylene polymer graft-modified with an unsaturated carboxylic acid or a derivative thereof, and satisfies the following requirements (1) to (4). (1) The melt flow rate (MFR) measured at a temperature of 190° C. and a load of 2160 g in accordance with ASTM D 1238 is 0.1 to 3 g/10 min. (2) The density is 910 to 930 kg/m3. (3) The proportion of fractions that elute at 50° C. and below in crystallization elution fractionation chromatography measurement is not less than 20 mass %. (4) The proportion of fractions that elute at 90° C. and above in crystallization elution fractionation chromatography measurement is not less than 25 mass %.
Public/Granted literature
- US20210108112A1 ADHESIVE RESIN COMPOSITION AND LAMINATE Public/Granted day:2021-04-15
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