Invention Grant
- Patent Title: Adhesives and related methods
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Application No.: US16022062Application Date: 2018-06-28
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Publication No.: US11292942B2Publication Date: 2022-04-05
- Inventor: Michael Zajaczkowski , Michael T. Waterman , Kyle R. Heimbach , Eric L. Bartholomew , Brandon S. Miller
- Applicant: Avery Dennison Corporation
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; C09J7/26 ; C09J5/06 ; C09J4/06 ; C09J133/00 ; C08L23/02 ; C08L33/00 ; C09J133/06 ; C09J123/02 ; C09J133/08 ; C09J4/00 ; C08K5/13 ; C08K5/3442 ; C09J133/14 ; C09J7/38 ; C08F222/10 ; C08F220/18
Abstract:
Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.
Public/Granted literature
- US20180305583A1 Adhesives and Related Methods Public/Granted day:2018-10-25
Information query
