Invention Grant
- Patent Title: Packaging arrangement and method for packaging
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Application No.: US16525421Application Date: 2019-07-29
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Publication No.: US11292661B2Publication Date: 2022-04-05
- Inventor: Haymo Niederkofler , Mathias Bratl
- Applicant: LOGICDATA Electronic & Software Entwicklungs GmbH
- Applicant Address: AT Deutschlandsberg
- Assignee: LOGICDATA Electronic & Software Entwicklungs GmbH
- Current Assignee: LOGICDATA Electronic & Software Entwicklungs GmbH
- Current Assignee Address: AT Deutschlandsberg
- Agency: Morgan, Lewis & Bockius LLP
- Priority: DE102018119035.2 20180806,DE102018126696.0 20181025
- Main IPC: B65D85/64
- IPC: B65D85/64 ; B65D77/04 ; A47C20/04

Abstract:
The disclosure relates to a packaging arrangement for storage and transport of electrically adjustable beds of a modular bed system which can be dismantled into individual components, the bed system being configured to form one or more different bed types which are different in terms of width and/or length. The beds are beds of a family of beds, comprise at least an upper leg sector, a lower leg sector, a seat sector and a torso sector, and have a plurality of bed plates for carrying a mattress. The packaging arrangement is suitable for accommodating a quantity of components of a single bed of each bed type of the bed system and the quantity of the components comprises at least the plurality of bed plates, at least one cross member and at least two longitudinal members. A width B of the packaging arrangement corresponds substantially to the width of a bed plate of a bed type, a length L of the packaging arrangement corresponds substantially to the length of one or the sum of the lengths of two bed plates of a bed type, and a base area of the packaging arrangement is substantially identical for all bed types of the bed system. A height H of the packaging arrangement is given by: H≤/2, where G is a limit for length plus girth of the packaging arrangement.
Public/Granted literature
- US20200039734A1 PACKAGING ARRANGEMENT AND METHOD FOR PACKAGING Public/Granted day:2020-02-06
Information query
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