Invention Grant
- Patent Title: Additive swept wedge buildup toolpath
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Application No.: US16476629Application Date: 2018-09-05
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Publication No.: US11292201B2Publication Date: 2022-04-05
- Inventor: James Maynard , Michael Taesch , Timothy R. Fithian , William Vittitow , Mai-Anh T Bui , Ashish Joshi
- Applicant: Siemens Industry Software Inc.
- Applicant Address: US TX Plano
- Assignee: Siemens Industry Software Inc.
- Current Assignee: Siemens Industry Software Inc.
- Current Assignee Address: US TX Plano
- International Application: PCT/US2018/049446 WO 20180905
- International Announcement: WO2019/055258 WO 20190321
- Main IPC: B29C64/393
- IPC: B29C64/393 ; G06F30/20 ; B33Y50/00 ; B33Y10/00 ; B33Y30/00 ; B33Y50/02

Abstract:
Systems and methods for designing and manufacturing an additive manufacturing (AM) model. A method includes computing a wedge plane and initial toolpath for an AMmodel based on a breaking angle. The method includes trimming an excess toolpath of the AM model using a breaking plane. The method includes building the toolpath along the normal of a first layer and trimming based on a next layer. The method includes building a next wedge of the toolpath in the direction of a wedge plane used to trim a previous wedge The method includes storing the toolpath.
Public/Granted literature
- US20200004907A1 ADDITIVE SWEPT WEDGE BUILDUP TOOLPATH Public/Granted day:2020-01-02
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