A ram extrusion apparatus including a die having several thermal zones, a hopper for introducing a granular polymer resin to the die, and a ram for moving the granular polymer resin through the thermal zones of the die and out from an outlet end thereof at a temperature above the crystalline melt temperature of the polymer resin. The hopper may be designed to deliver the polymer resin into a resin inlet of the die in a plurality of specifically metered amounts which may vary across a width of the resin inlet end of the die. The apparatus may further include one or more finishing tables positioned after the outlet end of the die for receiving and moving the extruded resin away from the outlet end of the die so that there is no backpressure on the extruded resin, and which provide compression force and even cooling to the extruded resin.