An implantable medical device is described. In an example, the implantable medical device includes an electromechanical substrate and sensor, such as a pressure sensor, disposed on the substrate. At least a portion of the sensor is packaged via a liquid encapsulation. The packaging includes a shaped flexible outer membrane that surrounds at least the portion of the sensor. The packaging also includes a hydrophobic liquid disposed between at least the portion of the pressure sensor and the flexible outer membrane. The implantable medical device can be a part of a medical system used for monitoring medical conditions or performing medical operations based on the implantable medical device. Additionally, manufacturing methods are described for packaging the sensor in a liquid encapsulation.