A radio frequency module includes: a duplexer for a first communication band; a first power amplifier and a first low-noise amplifier connected to the duplexer; a second power amplifier and a second low-noise amplifier for a second communication band; and a switch that switches a connection of an antenna connection terminal between the second power amplifier and the second low-noise amplifier, wherein the first power amplifier and the second power amplifier are disposed on a first principal surface of a module substrate, the first low-noise amplifier and the second low-noise amplifier are incorporated in a semiconductor IC disposed on a second principal surface of the module substrate, and in a plan view of the module substrate, the distance between the first power amplifier and the semiconductor IC is greater than the distance between the second power amplifier and the semiconductor IC.