Invention Grant
- Patent Title: Connector and manufacturing method thereof
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Application No.: US16702859Application Date: 2019-12-04
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Publication No.: US11276962B2Publication Date: 2022-03-15
- Inventor: Hiroki Yamada
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agent Gerald E. Hespos; Matthew T. Hespos; Michael J. Porco
- Priority: JPJP2018-228800 20181206
- Main IPC: H01R13/631
- IPC: H01R13/631 ; H01R13/436 ; H01R43/24 ; H01R9/24 ; H01R13/514 ; H01R43/18 ; H01R13/504 ; H01R13/405

Abstract:
A connector (1) includes first terminals (3A), a first resin core (2A), second connector terminals (3B), second resin cores (2B) and an outer resin part (4). Base ends (312) of inner end parts (31A) of the first terminals (3A) face a second exposed surface (21B) of the second resin core (2B) with a clearance (S) formed between the base end parts (312) and the second exposed surface (21B). Tips (311) of the inner end parts (31A) of the first terminals (3A) are formed with bent tips (311A) projecting away from the second exposed surface (21B). The second exposed surface (21B) has a size to entirely surround the inner end parts (31A) of the first terminals (3A).
Public/Granted literature
- US20200185858A1 CONNECTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-06-11
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