Invention Grant
- Patent Title: Semiconductor light receiving element
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Application No.: US16959624Application Date: 2018-02-01
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Publication No.: US11276790B2Publication Date: 2022-03-15
- Inventor: Takatomo Isomura , Etsuji Omura
- Applicant: KYOTO SEMICONDUCTOR CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: KYOTO SEMICONDUCTOR CO., LTD.
- Current Assignee: KYOTO SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Norris McLaughlin, P.A.
- International Application: PCT/JP2018/003454 WO 20180201
- International Announcement: WO2019/150535 WO 20190808
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L31/103 ; H01L31/167

Abstract:
A semiconductor light receiving element of back-illuminated type comprises a light absorbing portion formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light, and a first convex lens portion larger than the light absorbing portion and having a radius of curvature R1 formed on a back surface of the semiconductor substrate, a second convex lens portion smaller than the light absorbing portion and having a radius of curvature R2 smaller than the radius of curvature R1; the second convex lens portion formed on the first convex lens portion and having a focal point between the second convex lens portion and the light absorbing portion; light incident on the second convex lens portion is diffused from the focal point toward the light absorbing portion.
Public/Granted literature
- US20210193850A1 SEMICONDUCTOR LIGHT RECEIVING ELEMENT Public/Granted day:2021-06-24
Information query
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