Invention Grant
- Patent Title: Compressible foamed thermal interface materials and methods of making the same
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Application No.: US16513031Application Date: 2019-07-16
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Publication No.: US11276662B2Publication Date: 2022-03-15
- Inventor: Vijayaraghavan Rajagopal , Eugene Anthony Pruss , Richard F. Hill
- Applicant: LAIRD TECHNOLOGIES, INC.
- Applicant Address: US MO Chesterfield
- Assignee: LAIRD TECHNOLOGIES, INC.
- Current Assignee: LAIRD TECHNOLOGIES, INC.
- Current Assignee Address: US MO Chesterfield
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony Fussner
- Main IPC: H01L23/00
- IPC: H01L23/00 ; F28F13/00 ; H01L23/433 ; H01L23/373 ; C08J9/12
Abstract:
Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
Information query
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