Invention Grant
- Patent Title: Semiconductor device package with a cap to selectively exclude contact with mold compound
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Application No.: US16573651Application Date: 2019-09-17
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Publication No.: US11276615B2Publication Date: 2022-03-15
- Inventor: Laura May Antoinette Dela Paz Clemente , Jerry Gomez Cayabyab
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/043 ; H01L23/31
Abstract:
A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
Public/Granted literature
- US20200013688A1 SEMICONDUCTOR DEVICE PACKAGE WITH A CAP TO SELECTIVELY EXCLUDE CONTACT WITH MOLD COMPOUND Public/Granted day:2020-01-09
Information query
IPC分类:
