Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
-
Application No.: US16275118Application Date: 2019-02-13
-
Publication No.: US11276586B2Publication Date: 2022-03-15
- Inventor: Hidekazu Hayashi
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2018-169035 20180910
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306
Abstract:
A semiconductor manufacturing apparatus includes a mounting unit arranged to mount an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate. The apparatus further includes a holding unit arranged to hold the work substrate having the annular member mounted thereto. The apparatus further includes a first fluid supply unit arranged to supply a first fluid to the second substrate of the work substrate held by the holding unit.
Public/Granted literature
- US20200083066A1 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2020-03-12
Information query
IPC分类:
