Invention Grant
- Patent Title: Electronic component
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Application No.: US16849681Application Date: 2020-04-15
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Publication No.: US11276528B2Publication Date: 2022-03-15
- Inventor: Man Su Byun , Ho Yoon Kim , Soo Hwan Son
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0162558 20191209
- Main IPC: H01G2/02
- IPC: H01G2/02 ; H01G4/012 ; H01G4/12 ; H01G4/232 ; H01G4/30

Abstract:
An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.
Public/Granted literature
- US20210175019A1 ELECTRONIC COMPONENT Public/Granted day:2021-06-10
Information query