Invention Grant
- Patent Title: Method for producing circuit board and method for producing integrated circuit including the same
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Application No.: US16253226Application Date: 2019-01-22
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Publication No.: US11272622B2Publication Date: 2022-03-08
- Inventor: Yasuo Matsumura , Sumiaki Yamasaki , Tsuyoshi Murakami , Kana Yoshida , Shuji Sato
- Applicant: FUJIFILM Business Innovation Corp.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2018-171873 20180913
- Main IPC: H05K3/12
- IPC: H05K3/12 ; H05K3/02 ; H05K1/18 ; H05K1/02
Abstract:
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
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