Invention Grant
- Patent Title: Flexible substrate
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Application No.: US17141673Application Date: 2021-01-05
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Publication No.: US11272612B2Publication Date: 2022-03-08
- Inventor: Yoshihiro Tomita
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2014-134415 20140630
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18

Abstract:
A flexible substrate includes a plurality of unit wiring structures and an insulation sheet on which the plurality of unit wiring structures are disposed. Each of the plurality of unit wiring structures includes a central section and a plurality of strips disposed at an outer side of the central section. Each of the plurality of strips has a first end and a second end, and is curved along an outer periphery of at least part of the central section, the first end connected to the central section. The plurality of strips in each of the plurality of unit wiring structures curve in a clockwise or a counterclockwise manner with the central section as a center of rotation. The plurality of unit wiring structures include at least four unit wiring structures arranged in a two-dimensional manner.
Public/Granted literature
- US20210127485A1 FLEXIBLE SUBSTRATE Public/Granted day:2021-04-29
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