Invention Grant
- Patent Title: Systems and methods for interconnecting and isolating antenna system components
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Application No.: US16443286Application Date: 2019-06-17
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Publication No.: US11271309B2Publication Date: 2022-03-08
- Inventor: Zachary T. Miers , Joseph E. Diener , Peter J. Moosbrugger
- Applicant: Ball Aerospace & Technologies Corp.
- Applicant Address: US CO Boulder
- Assignee: Ball Aerospace & Technologies Corp.
- Current Assignee: Ball Aerospace & Technologies Corp.
- Current Assignee Address: US CO Boulder
- Agency: Sheridan Ross P.C.
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H05K1/02 ; H05K1/11 ; H01Q21/06 ; H01Q21/00 ; H01Q1/52

Abstract:
An antenna system circuit board stack with feed vias and with non-feed vias is disclosed. An antenna system circuit board stack as disclosed herein can include a plurality of patches or radiating elements formed on a common plane comprising a first surface of a circuit board. Each radiating element is electrically connected to one or more feed vias. In addition non-feed vias extend through, but are electrically isolated from, the radiating elements. An antenna system as disclosed herein enables the costs associated with multiple beam antenna systems, including but not limited to 5G communication systems, to be reduced as compared to alternative techniques.
Public/Granted literature
- US20200053870A1 SYSTEMS AND METHODS FOR INTERCONNECTING AND ISOLATING ANTENNA SYSTEM COMPONENTS Public/Granted day:2020-02-13
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