Invention Grant
- Patent Title: Wiring board, coupler module, and communication device
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Application No.: US16882879Application Date: 2020-05-26
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Publication No.: US11271306B2Publication Date: 2022-03-08
- Inventor: Yukiteru Sugaya
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2016-233095 20161130
- Main IPC: H03F3/24
- IPC: H03F3/24 ; H04B1/04 ; H05K1/11 ; H04B1/00 ; H01Q5/50 ; H05K1/02 ; H05K1/18
Abstract:
A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.
Public/Granted literature
- US20200287285A1 WIRING BOARD, COUPLER MODULE, AND COMMUNICATION DEVICE Public/Granted day:2020-09-10
Information query
IPC分类:
