Invention Grant
- Patent Title: Electronic device and method for fabricating the same
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Application No.: US16711264Application Date: 2019-12-11
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Publication No.: US11271039B2Publication Date: 2022-03-08
- Inventor: Chi-Ho Kim , Min-Seon Kang , Hyun-Seok Kang , Hyo-June Kim , Jae-Geun Oh , Su-Jin Chae
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2019-0060003 20190522
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
This technology provides an electronic device and a method for fabricating the same. An electronic device in accordance with an implementation of this document may include a substrate including a first portion in a first region and a second portion in a second region; a plurality of memory cells disposed over the first portion of the substrate; a first insulating layer extending over the second portion of the substrate and at least partially filling a space between adjacent ones of the plurality of memory cells; and a second insulating layer disposed over the first insulating layer. The first insulating layer has a dielectric constant smaller than that of the second insulating layer, a thermal conductivity smaller than that of the second insulating layer, or both.
Public/Granted literature
- US20200373353A1 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-11-26
Information query
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