Invention Grant
- Patent Title: Electronic circuit connection method and electronic circuit
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Application No.: US16973020Application Date: 2019-05-30
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Publication No.: US11270968B2Publication Date: 2022-03-08
- Inventor: Masaru Hashino , Ying Ying Lim , Hiroshi Nakagawa , Masahiro Aoyagi , Katsuya Kikuchi
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Applicant Address: JP Tokyo
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-112722 20180613
- International Application: PCT/JP2019/021519 WO 20190530
- International Announcement: WO2019/239909 WO 20191219
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/00

Abstract:
The purpose of the present invention is to provide an electronic circuit connection method and an electronic circuit capable of improving the reliability of electrical connection.
A connection method for an electronic circuit 100 includes: a process of forming a first metal bumps 30 and a second metal bump 40, each of which has a cone shape; and a process of joining a first electrode pad 12 and a third electrode pad 22 by the first metal bump 30 and joining a second electrode pad 13 and a fourth electrode pad 23 by the second metal bump 40, wherein at least one region of between a first region 11a and a second region 11b in a first connection surface 11 and between a third region 21a and a fourth region 21b in a second connection surface 21 has a step 11c, and the first metal bump 30 and the second metal bump 40 have different heights so as to correct a height H1 of the step 11c.
A connection method for an electronic circuit 100 includes: a process of forming a first metal bumps 30 and a second metal bump 40, each of which has a cone shape; and a process of joining a first electrode pad 12 and a third electrode pad 22 by the first metal bump 30 and joining a second electrode pad 13 and a fourth electrode pad 23 by the second metal bump 40, wherein at least one region of between a first region 11a and a second region 11b in a first connection surface 11 and between a third region 21a and a fourth region 21b in a second connection surface 21 has a step 11c, and the first metal bump 30 and the second metal bump 40 have different heights so as to correct a height H1 of the step 11c.
Public/Granted literature
- US20210249374A1 ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT Public/Granted day:2021-08-12
Information query
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