Invention Grant
- Patent Title: Method for detecting a breach of the integrity of a semiconductor substrate of an integrated circuit from its rear face, and corresponding device
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Application No.: US16267573Application Date: 2019-02-05
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Publication No.: US11270957B2Publication Date: 2022-03-08
- Inventor: Alexandre Sarafianos , Bruno Nicolas , Daniele Fronte
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1851011 20180207
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G06F21/77 ; G06F21/75 ; G06K19/073

Abstract:
A semiconductor substrate of an integrated circuit is protected by a coating. The semiconductor includes a front face and a rear face. To detect a breach of the integrity of a semiconductor substrate of an integrated circuit from the rear face, an opening of the coating facing the rear face of the substrate is detected. In response thereto, an alarm is generated. The detection is performed by making resistance measurements with respect to the semiconductor substrate and comparing the measured resistance to a nominal resistive value of the semiconductor substrate.
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