Invention Grant
- Patent Title: Semiconductor wafer, semiconductor chip and method of fabricating a semiconductor wafer
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Application No.: US16385233Application Date: 2019-04-16
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Publication No.: US11270948B2Publication Date: 2022-03-08
- Inventor: Oliver Blank
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP18167785 20180417
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/78
Abstract:
In an embodiment, a semiconductor wafer is provided that includes a plurality of component positions with scribe line regions located at least one of adjacent to and between the component positions. The component positions include an active device structure. An auxiliary structure is positioned in one or more of the scribe line regions. The auxiliary structure is electrically coupled to an auxiliary contact pad which includes tungsten.
Public/Granted literature
- US20190318995A1 Semiconductor Wafer, Semiconductor Chip and Method of Fabricating a Semiconductor Wafer Public/Granted day:2019-10-17
Information query
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