Invention Grant
- Patent Title: Chip part and manufacturing method thereof
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Application No.: US16590945Application Date: 2019-10-02
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Publication No.: US11270932B2Publication Date: 2022-03-08
- Inventor: Hideaki Yamaji
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2018-190198 20181005
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/522 ; H01L23/29 ; H01L29/861 ; H01L21/56 ; H01L21/304
Abstract:
A chip part includes a chip main body which has a first main surface at one side, a second main surface at the other side and side surfaces that connect the first main surface and the second main surface and which includes a terminal electrode exposed from the first main surface, and an outer surface resin which exposes the first main surface of the chip main body and covers an outer surface of the chip main body.
Information query
IPC分类:
