Invention Grant
- Patent Title: Low profile transducer module
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Application No.: US16157142Application Date: 2018-10-11
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Publication No.: US11267698B2Publication Date: 2022-03-08
- Inventor: Horst Theuss , Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: B81B7/00
- IPC: B81B7/00

Abstract:
A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.
Public/Granted literature
- US20190039882A1 LOW PROFILE TRANSDUCER MODULE Public/Granted day:2019-02-07
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