Invention Grant
- Patent Title: Liquid ejecting apparatus and maintenance method for liquid ejecting apparatus
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Application No.: US16866048Application Date: 2020-05-04
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Publication No.: US11267247B2Publication Date: 2022-03-08
- Inventor: Masato Murayama , Atsushi Yoshida , Kazushi Arafuka , Mizuki Yokouchi , Masanobu Yamaguchi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JPJP2019-087657 20190507
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A liquid ejecting apparatus includes a wiping mechanism that includes a wiping portion configured to move in a wiping direction, in which a first nozzle surface and a second nozzle surface each provided with nozzles of a liquid ejecting portion are aligned, and to wipe the first nozzle surface and the second nozzle surface, and an isolation region in which the wiping portion is not brought into contact with the first nozzle surface and the second nozzle surface when a gap between the first and second nozzle surfaces and the wiping portion in an ejecting direction of liquid from the nozzles is a contact interval at which the first nozzle surface and the second nozzle surface are wiped is provided between the first nozzle surface and the second nozzle surface in the wiping direction.
Information query
IPC分类: