Invention Grant
- Patent Title: Joint tape, method and apparatus for connection of packing film utilizing the same
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Application No.: US16580599Application Date: 2019-09-24
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Publication No.: US11267204B2Publication Date: 2022-03-08
- Inventor: Naoki Yokoyama , Naoya Hamada , Tomohiro Shibasaki
- Applicant: TAISEI LAMICK CO., LTD.
- Applicant Address: JP Saitama
- Assignee: TAISEI LAMICK CO., LTD.
- Current Assignee: TAISEI LAMICK CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2019-005216 20190116
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/50 ; B29C65/18 ; B29C65/74 ; B29C65/02 ; B29C65/78

Abstract:
The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
Public/Granted literature
- US20200223151A1 JOINT TAPE, METHOD AND APPARATUS FOR CONNECTION OF PACKING FILM UTILIZING THE SAME Public/Granted day:2020-07-16
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